CoWoS might additionally maintain attention-grabbing alternatives for Apple, because it’s a sophisticated chip packaging tech that may effectively hyperlink graphics processors, reminiscence, and CPU collectively. There could also be some implications as Apple is anticipated to maneuver to 2nm chips (made by TSMC, designed by Apple’s silicon groups, and primarily based on Arm reference designs) in 2025.
TSMC Chairman and CEO C.C. Wei referenced this somewhat earlier within the yr, telling Nikkei, “AI is so sizzling that each one my prospects need to put AI into their units.” As historical past reveals, Apple has now completed exactly that and Nvidia makes use of CoWoS chip packaging tech in its personal high-performance graphics processors.
What the companions say
Hypothesis apart, that is what Amkor and TSMC needed to say in a assertion asserting the settlement: “Amkor is proud to collaborate with TSMC to supply seamless integration of silicon manufacturing and packaging processes by means of an environment friendly turnkey superior packaging and take a look at enterprise mannequin in the USA,” stated Giel Rutten, Amkor’s president and CEO. “This expanded partnership underscores our dedication to driving innovation and advancing semiconductor expertise whereas guaranteeing resilient provide chains.”